Power Integrations recommends the use of IR/convection reflow for surface-mount attach of the InSOP package. However, the InSOP package was designed with wave soldering in-mind in case IR/ convection ...

SolderStar has announced a new wave solder analyser – WaveShuttle PRO. In addition to preheat temperature profiles, Solder Pot temperature, chip and main wave dwell time and parallelism information, ...

Applying liquid solder to the underside of printed circuit boards in order to bond the chips and discrete components that are placed on top of the board and whose metal leads (pins) extend through the ...

Sasinno Americas is set to exhibit its latest advancements at Booth 4027 during the 2024 IPC APEX EXPO, taking place April 9-11, 2024 at the Anaheim Convention Center in California. The company will ...

Indium Corporation introduces a full line of soldering products that satisfy IPC's J-STD004B. The IPC's new 004B has stricter requirements for measuring halogens and electromigration risk. Indium ...