PC Magazine tested the X2 Plus against the Intel Core Ultra 7 268V, Core Ultra 9 285H, Ryzen AI 9 HX Pro 375, and Ryzen AI ...

AI has turned computer memory from a cheap commodity into the hottest ticket in the chip world, and the shelves are starting ...

The Indian PV manufacturer has launched Conserv Augmensheet, a sheet encapsulant for insulation and sealing of busbar and junction box areas in solar modules. Supplied in reel format, the product ...

Qin Ling, CTO of MOVA, said: “NAVAX 5000 AWD brings satellite based RTK positioning together with vision and LiDAR to deliver ...

Samsung Electronics is riding a wave of artificial intelligence demand that is transforming a painful memory-chip downturn ...

Binocular Full-Color AR Glasses Reference Design "Rubis" Debuts with Tri-Chip Architecture and EMG Interaction The path to mainstream adoption of consumer AI-powered AR glasses has been hindered by ...

Synopsys has introduced its HPC multi-channel MACsec Security Modules, engineered to efficiently support high data rates, ranging from 200Gbps to 1.6Tbps, with built-in scalability to reach ...

Apple's iPhone development roadmap runs several years into the future and the company is continually working with suppliers ...

Just yesterday, we wrote about the Qualcomm Dragonwing Q‑7790 and Q‑8750 AIoT SoCs, and on the same day, Quectel launched the ...

AMD used CES 2026 to announce a new line-up of Ryzen AI processors to go up against Intel’s latest in thin-and-light ...

The BCM4918 is designed to be used with two new radio chips, BCM6714 and BCM6719, that Broadcom debuted in conjunction. A ...

The GPU made its debut at CES alongside five other data center chips. Customers can deploy them together in a rack called the Vera Rubin NVL72 that Nvidia says ships with 220 trillion transistors, ...