The NAND modules are soldered onto a PCB, and the memory controller is on the SoC. Better yet, older designs had the entire ...

The DRAM industry has long been plagued by the security risk of RowHammering, and mitigation techniques have done little to ...

Finding your ideal smartphone can be complicated, but having a processor that can handle whatever you throw at it is vital.

The new QLC UFS Ver. 4.0 device integrates the company’s innovative BiCS FLASH 3D flash memory and a controller in a JEDEC standard package. UFS 4.0 incorporates MIPI M-PHY 5.0 and UniPro 2.0 and ...

SK Hynix has strengthened its collaboration with TSMC, designating the foundry to manufacture its next-generation HBM4 logic die. The company's development of high-capacity Compute Express Link (CXL) ...

The new AMD Ryzen 7 9800X3D pairs Zen 5 with 2nd Generation 3D V-Cache to boost gaming perfomance, increase clocks, and ...

Silicon Motion faces near-term market weakness but is poised for a 2025 rebound, especially in QLC NAND. Read why I maintain ...

So much has changed since then but one thing still remains true: the PC is the platform to enjoy gaming at its very best.

Wells Fargo & Company initiated coverage on shares of Rambus (NASDAQ:RMBS – Free Report) in a research note issued to investors on Wednesday, MarketBeat.com reports. The brokerage issued an overweight ...

Additionally, the company launched a new high-bandwidth memory controller (HBM4) for AI and graphics-heavy applications, ...

There are lots of ways that we might build out the memory capacity and memory bandwidth of compute engines to drive AI and ...

Renesas has expanded its Arm Cortex-M85-based RA8 series to include two new entry-level MCUs, RA8E1 and RA8E2. The new ...