New portfolio drives chip performance with panel-based interconnect innovation KLA is extending the capability of the proven Corus™ direct imaging platform and introducing the Serena™ direct imaging ...

Intel Corporation INTC is set to revolutionize the industry with the ground-breaking launch of glass substrates for advanced packaging of chips. This industry-leading product is likely to be available ...

SEMI and Global Net have released a new report examining the emerging market for glass core substrates, a packaging technology being evaluated for future semiconductor applications as artificial ...

As packaging shifts towards recyclability and sustainability, coatings, substrates, curing systems and converting ...

No matter how you get your news, it seems like everyone is talking about AI – and it’s either going to usher in a new era of productivity or lead to the end of humankind itself. Regardless, the AI era ...

Trade organization SEMI forecasts that the glass core substrate market is expected to grow substantially from 2028 to 2040 ...

Rapidus, which positions itself as a vertically integrated chipmaker that offers both front-end semiconductor production and back-end packaging, plans to discuss its efforts in the field of ...

BOE Technology chairman Chen Yanshun revealed at the 2025 BOE Investor Day that the company will pivot toward glass substrate packaging and perovskite solar cell (PSC) technology as strategic growth ...

LG Innotek has announced a plan to build its first semiconductor substrate plant in Vietnam, marking a significant step in ...

Glass more than half full.

As more AI GPU, CPU, and ASIC customers ramp up their market push, advanced packaging capacity continues to face tight supply. This has prompted upstream IC packaging substrate makers to adopt a more ...