FREMONT, Calif.–Lam Research Corp. here today introduced a new platen for its 200-mm wafer chemical mechanical planarization (CMP) system designed to extend reliable control of polishing processes ...
Grenoble, France. Leti, a research institute at CEA Tech, and CMP, a service organization that provides prototyping and low-volume production of ICs and MEMS, today announced the industry’s first ...
Chemical mechanical polishing (CMP) – also known as planarization – has long been the most commonly employed technique for smoothing and flattening wafer surfaces during the fabrication of ...
This will expand the role of advanced CMP consumables, high-precision metrology, and contamination control. Epi wafers gain strategic value As device architectures become more demanding, epi quality ...
A fundamental component of modern electronic goods is the semiconductor. More powerful, faster and smaller processors are in constant demand for many services and goods because of the advent of the ...
SAN LUIS OBISPO, Calif., July 6, 2023 /PRNewswire/ -- Revasum today announced the availability of 200mm SiC wafer polishing capability on their 6EZ chemical mechanical polishing platform. The 6EZ has ...
As demand for device slips below 0.18m m, are relying more machinable help get silicon wafers through the fab line quickly with less consumable costs and fewer defects per wafer. OEMs and fabs want to ...
LONDON — Circuits Multi Projets (CMP), a multiproject wafer run aggregator, has introduced access to a 65-nanometer CMOS process from STMicroelectronics NV. The ST 65-nm library includes process ...
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