Nobody wants chips to fail in the field, but at 65 nanometers and below, sudden failure becomes a real threat. Among the most likely causes is electromigration, a problem that's affected ICs since the ...
The replacement of aluminum with copper interconnect wiring, first demonstrated by IBM in 1997, brought the integrated circuit industry substantial improvements in both resistance to electromigration ...
The shift towards the 28nm node and beyond has put the spotlight back on the interconnect in semiconductor manufacturing. In chip scaling, the big problem in the interconnect is resistance-capacitance ...
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