The semiconductor industry's push toward advanced packaging has made wafer dicing the critical gatekeeper of yield, especially for ultra-thin wafers and complex copper pillar interconnects. In 2026, ...
ORLANDO, Fla.--(BUSINESS WIRE)--Fonon Corporation, a multi-market holding company, R&D center, equipment designer and manufacturer of advanced laser material processing systems for subtractive and ...
TOKYO--(BUSINESS WIRE)--Furukawa Electric Co., Ltd. (TOKYO:5801) has begun mass producing expand separation dicing tape, a type of tape for use with semiconductors. Expand separation dicing tape ...
Advances in laser grooving means that manufacturers are able to optimize die separation quality by combining traditional blade dicing and laser grooving techniques to separate individual chips from ...
The FINANCIAL — Panasonic Corporation, and Tokyo Seimitsu Co., Ltd. (hereinafter Tokyo Seimitsu) on March 12 announced that Tokyo Seimitsu and Panasonic’s subsidiary’s company, Panasonic Smart Factory ...
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