A new development in chip packaging could change how AI processors are built, making them smaller, faster, and more stable in ...

KYOTO, Japan--(BUSINESS WIRE)--Kyocera Corporation (President: Shiro Sakushima; “Kyocera”) today announced that it is commercializing a new multilayer ceramic core substrate for advanced semiconductor ...

A multilayer technology developed by substrate manufacturer Lamina Ceramics (Westampton, NJ) enables unfired ceramic to be bonded to either Kovar or copper-molybdenum-copper (CuMoCu) metal. Offering ...

Silicon nitride ceramic substrates play a pivotal role in Active Metal Brazing (AMB) substrates for power modules whose applications include inverters for electric vehicle (EV) and hybrid electric ...

To be shown at ECTC 2026, May 26-29 in Orlando; new substrate technology delivers superior rigidity and circuit miniaturization for next-gen data centers, AI, and ASIC packaging Built from Kyocera’s ...